Features 01
Expected Problems
To customers who are struggling......
-without good fillers that offers both high heat dissipation performance and high withstand voltage.
-with high filling of BN in epoxy and polyimide resins .
-with cracking or warping of ceramics.
-to enlarge insulating layer for use in power devices.
-to simplify the power device manufacturing process.
Features 02
Technology highlight
? Formation of an aggregated particles by a proprietary high-temperature synthesis technique which is different from granulation.
? Control techniques for the aggregated particle size and particle size distribution corresponding to the application.
? Strict quality control and inspection techniques.
(Image analysis technology, ion analysis technology, technologies for measurement of aggregated particle properties, etc.)
Features 03
Proposed Solutions (Examples)
?High filling performance in epoxy and polyimide resins,
?High withstand voltage by void-less heat-dissipating resin sheets.
?By forming insulating heat-dissipating sheets:
-Free from warping of ceramic substrate
-Realizing large scale insulating layers
-Simplifying adhesion layer.