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Withstand VoltageInsulation reliabilityHigh heat dissipationLow dielectricSize/weight reductionCost reduction

Thermal Management

Boron Nitride (BN) Powder – A Material with High Thermal Conductivity and High Withstand Voltage

Boron nitride (BN) filler - Offering the possibility of a next-generation electrical-insulating heat-dissipation materials

Solution Point

  • BN is aggregated by a proprietary technology, decrease in anisotropic thermal conductivity in sheets, which is a weak point of flake-type BN.
  • The primary particles that form aggregated particles are thick, and the shape enables easy heat conduction in the aggregated particles.
  • Filling resin in the voids in the aggregated particles is easy, and it is possible to achieve withstand voltage because the shape makes void formation difficult.
  • By filling the aggregated particles without collapse, it is possible to form of effective heat transfer paths and thereby achieve high thermal conductivity.
    (Now already being used by customers as a filler in electrical-insulating heat-dissipation products.)

Features 01

Expected Problems
To customers who are struggling......
-without good fillers that offers both high heat dissipation performance and high withstand voltage.
-with high filling of BN in epoxy and polyimide resins .
-with cracking or warping of ceramics.
-to enlarge insulating layer for use in power devices.
-to simplify the power device manufacturing process.

Features 02

Technology highlight
? Formation of an aggregated particles by a proprietary high-temperature synthesis technique which is different from granulation.
? Control techniques for the aggregated particle size and particle size distribution corresponding to the application.
? Strict quality control and inspection techniques.
(Image analysis technology, ion analysis technology, technologies for measurement of aggregated particle properties, etc.)
Metal substrate

Features 03

Proposed Solutions (Examples)
?High filling performance in epoxy and polyimide resins,
?High withstand voltage by void-less heat-dissipating resin sheets.
?By forming insulating heat-dissipating sheets:
 -Free from warping of ceramic substrate
 -Realizing large scale insulating layers
 -Simplifying adhesion layer.
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